| Quantum CAD - More than just PCB Design |
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Quantum CAD has been a well respected company in the field of PCB design for several years but you may not have realised that they offer far more than just PCB design services.
Since 2006, their expansion plans have grown their services portfolio to an extent that they are now able to offer impressive “concept to product” solutions.
“Having built a team with a combined knowledge and experience of over 200 years in the electronics design industry, it seemed an obvious and logical step to offer our clients a complete ‘one-stop-shop’ package”. Steve Jones, Managing Director. “Rather than having to co-ordinate several other firms and sub-contractors to bring their products to market, clients can now simply come to us and we can take care of the entire project for them”.
The most rapidly growing new service has been the full electronic product design. Clients are able to take a concept and through a collaborative process with the team, produce the initial design and take it right through to final production. Both hardware and software can be catered for and by keeping all the development work in-house, tighter controls on specification changes and schedules is far simpler resulting in a reduction in time to market. Inevitably this all combines to reduce the development budget.
Allied to hardware design is the pre-design study service. Steve Jones; “Having the ability to be able to model designs for Signal Integrity, PCB technology, mechanical fit to the enclosure and thermal before committing anything to pre-production is becoming increasingly paramount in the bid to reduce overall product costs. The earlier analysis can be performed in the design lifecycle, the greater the opportunity to reduce product lifecycle costs by reducing prototypes and costly failures in the field.
Designs are getting more and more complex, components working faster, demand to make designs smaller and smaller. All of these requirements can become a conflict to performance. Signal Integrity may require greater packing density which could have an impact on thermal performance. Being able to trade off these parameters early in the design lifecycle will have a major impact on delivering products to the market on time, to cost and to the expected quality.
Sep 2008 |
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Dated: 02/09/2008 |
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