PCB Fabrication, Assembly and Test

DFM/DFT/DFA (Design for Manufacturing, Design for Test, Design for Assembly)

The Problem
In today’s market, there is enormous pressure on electronics companies to develop and produce faster and smaller products, at lower costs and to the highest possible quality standards. Design iterations must be eliminated or greatly reduced in order to stay competitive and get to market first.

The Solution
At Quantum CAD, we understand those pressures, and feel very strongly about the value of excellent PCB design and layout. We therefore employ DFM/DFT/DFA methodologies throughout our PCB design and layout services. Those methodologies guarantee that the electronic products you develop with the PCBs we design and manufacture will be of highest quality, improved manufacturability and reliability, have a reduced lead-time, and deliver the performance you expect at the lowest possible production cost.

DFM - Design for Manufacturing

Ensures that the design fits the fabrication process requirements, and includes checks for minimal trace width, minimal trace-to-trace distance, minimal hole clearance, etc
Offers greatest benefits when used early in the design process (concept stage)

DFT - Design for Test

Provides a means to reduce test generation complexity as well as to focus the test at the aspect to test (e.g. connectivity at board level or component type), hence increasing the accuracy of faulty response data
Is used during the design phase

DFA - Design for Assembly

Generates feedback on the consequences of design decisions on product assembly
Application of DFA guides us towards a product with an optimum number of parts, that requires simple, cost-effective assembly operations and the most appropriate manufacturing processes and materials for its components

Through using those methodologies, we ensure that potential difficulties in the manufacturing process are eliminated in the design and prototyping stage.